Modeling and Analyzing the Temperature Field of the Swing Substrate in Miniature EACVD System |
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| Journal | Key Engineering Materials (Volumes 431 - 432) |
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| Volume | Machining and Advanced Manufacturing Technology X |
| Edited by | Yingxue Yao, Dunwen Zuo and Xipeng Xu |
| Pages | 45-48 |
| DOI | 10.4028/www.scientific.net/KEM.431-432.45 |
| Citation | Hong Xiang Wang et al., 2010, Key Engineering Materials, 431-432, 45 |
| Online since | March, 2010 |
| Authors | Hong Xiang Wang, Dun Wen Zuo, Wen Zhuang Lu, Feng Xu |
| Keywords | Diamond Film, Miniature EACVD System, Model, Temperature Field |
| Abstract | The magnitude and the uniformity of the substrate temperature are the most important factors that affect the quality and the growth rate of diamond films deeply. In this paper, the model of the swing substrate temperature field is established according to the heat transfer theory in Miniature EACVD System, the effects of the hot-filament parameters and the substrate swing parameters on the magnitude and uniformity of the substrate temperature were discussed. The calculated results show that the hot-filament parameters have great influence on the magnitude of the substrate temperature , the results also show that the hot-filament number , the substrate swing angle and the distance between the hot-filament and the substrate affect the uniformity of the substrate temperature field deeply. All the results provide a basis for optimizing the parameters of deposition in Miniature EACVD System. |
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