Paper Title:
Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal
  Abstract

Abstract. The reaction layer microstructure of SiC/SiC joints brazed by Ag-Cu-Ti filler metal, including composition, morphology, grain size were investigated by X-ray diffraction, electronic probe microanalysis, transmission electron microscope. An obvious reaction layer composed of TiC and Ti5Si3 was observed at the interface of SiC substrate and filler metal. There is a representative structure of SiC substrate/continuous fine TiC layer /discontinuous coarse Ti5Si3 layer/filler metal in the reaction layer. The continuous TiC layer, composed of about 10 nm roundish grains, is 350 ~ 400 nm thick. Ti5Si3 layer is composed of only one row of Ti5Si3 grains, which disperse with diverse size from 100 ~ 500 nm. Different growth behavior of TiC and Ti5Si3 is the main reason to form this microstructure.

  Info
Periodical
Key Engineering Materials (Volumes 434-435)
Edited by
Wei Pan and Jianghong Gong
Pages
202-204
DOI
10.4028/www.scientific.net/KEM.434-435.202
Citation
Y. Liu, Z. R. Huang, X. J. Liu, "Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal", Key Engineering Materials, Vols. 434-435, pp. 202-204, 2010
Online since
March 2010
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Price
$32.00
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