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Property and Microstructure of CNTs/AlN Ceramics

Journal Key Engineering Materials (Volumes 434 - 435)
Volume High-Performance Ceramics VI
Edited by Wei Pan and Jianghong Gong
Pages 48-49
DOI 10.4028/www.scientific.net/KEM.434-435.48
Citation Hong Lei Wang et al., 2010, Key Engineering Materials, 434-435, 48
Online since March, 2010
Authors Hong Lei Wang, Xin Gui Zhou, Hai Jiao Yu, Shu Ang Zhao, Zheng Luo
Keywords AlN, Carbon Nanotubes, Hot-Pressing, Thermal Conductivity (TC)
Abstract

CNTs/AlN ceramics were fabricated by hot-pressing and their bulk density, flexural strength, thermal conductivity were characterized. The microstructure was also investigated. The fracture surface were analyzed by SEM. TEM was used for analyzing the microstructure. It is found that the density, mechanic and thermal-conductivity properties markedly decreased as the CNTs reinforced AlN ceramic; through microstructure observation, the conglomeration of CNTs mostly exist among the AlN grain boundary, and the CNTs were scathed by the high temperature and pressure of the hot-pressing.

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