Understanding the Temperature Field in Plunge Cylindrical Grinding for Grinding-Hardening |
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| Journal | Key Engineering Materials (Volume 443) |
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| Volume | Advances in Materials Processing IX |
| Edited by | Jun Wang,Philip Mathew, Xiaoping Li, Chuanzhen Huang and Hongtao Zhu |
| Pages | 388-393 |
| DOI | 10.4028/www.scientific.net/KEM.443.388 |
| Citation | Thai Nguyen et al., 2010, Key Engineering Materials, 443, 388 |
| Online since | June, 2010 |
| Authors | Thai Nguyen, Liang Chi Zhang |
| Keywords | Grinding Hardening, Plunge Cylindrical Grinding, Temperature Field, Tempering |
| Abstract | This paper investigates the temperature field in plunge cylindrical grinding with the aid of the finite element analysis. The analysis included the effect of the variation of the depth of cut and that of the repeated heating and cooling caused by workpiece rotation. It was found that the predictions agree well with the experimentally measured results. The analysis showed that the heating in the consequent rotations further raises the temperature in the workpiece. The reheating in the hardened layer can lead to material’s tempering. |
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