Paper Title:
Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer
  Abstract

Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. However, effect of additive in CMG wheel is not completely understood yet. In this paper, three different CMG wheels were developed, in which one excluded additive and the other two contained two kinds of additive i.e. silicon dioxide and sodium carbonate. Grinding experiments were conducted to explore the influence of exclusion of additive and inclusion of different kinds of additive on CMG performance. The grinding characteristics of the three wheels were also analyzed and discussed to reveal the roles of wheel compositions in CMG process. This work provides some fundamental insights for the selection of different types of additive for optimization of CMG wheel.

  Info
Periodical
Key Engineering Materials (Volumes 447-448)
Edited by
Jianhong Zhao, Masanori Kunieda, Guilin Yang and Xue-Ming Yuan
Pages
106-110
DOI
10.4028/www.scientific.net/KEM.447-448.106
Citation
H. Takahashi, Y.B. Tian, Y. Mikami, J. Shimizu, L. B. Zhou, Y. Tashiro, H. Iwase, S. Kamiya, "Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer", Key Engineering Materials, Vols. 447-448, pp. 106-110, 2010
Online since
September 2010
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Price
$32.00
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