Effects of Crystallographic Structure on Machining Performance with Polycrystalline Oxygen Free Copper by a Single Crystalline Diamond Micro-Tool
| Periodical | Key Engineering Materials (Volumes 447 - 448) |
|---|---|
| Main Theme | Advances in Precision Engineering |
| Edited by | Jianhong Zhao, Masanori Kunieda, Guilin Yang and Xue-Ming Yuan |
| Pages | 31-35 |
| DOI | 10.4028/www.scientific.net/KEM.447-448.31 |
| Citation | X. Ding et al., 2010, Key Engineering Materials, 447-448, 31 |
| Online since | September, 2010 |
| Authors | X. Ding, L.C. Lee, David Lee Butler, Kah Chuan Shaw |
| Keywords | Crystallographic Orientation, Micro Machining, SCD Micro-Tool |
| Price | US$ 28,- |
A study was carried out to investigate effects of crystallographic structure on the machining performance with polycrystalline oxygen free copper (OFC) using a single crystalline diamond (SCD) micro-tool. The SCD micro-tool used in this study fabricated with a focused ion beam (FIB) has a cutting length of around 30 µm on the primary clearance face. It was found that a change in crystallographic orientation resulted in a variation in machining force, chip thickness and shear angle, leading to a change in machined surface integrity. When a micro-size tool traverses within a grain at a machining direction aligned with a particular crystallographic orientation, the work material in front of the machining tool is found to be severely deformed. If the orientation changes to a less favorable orientation, this may lead to a much reduced shear angle, a thicker chip, striation at the chip back, higher machining forces and a degraded machined surface. This study contributes to the understanding of the physics of micro scale mechanical machining (micro-machining).
