Paper Title:
Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container
| Periodical | Key Engineering Materials (Volumes 447 - 448) |
|---|---|
| Main Theme | Advances in Precision Engineering |
| Edited by | Jianhong Zhao, Masanori Kunieda, Guilin Yang and Xue-Ming Yuan |
| Pages | 61-65 |
| DOI | 10.4028/www.scientific.net/KEM.447-448.61 |
| Citation | Kei Kitamura et al., 2010, Key Engineering Materials, 447-448, 61 |
| Online since | September, 2010 |
| Authors | Kei Kitamura, Toshiro K. Doi, Syuhei Kurokawa, Yoji Umezaki, Yoji Matsukawa, Yota Ooki, Tadashi Hasegawa, Isamu Koshiyama, Koichiro Ichikawa, Yoshio Nakamura |
| Keywords | Atmosphere, CMP, Double-Side Polishing, Gas Pressure, Removal Rate, Silicon Wafer |
| Price | US$ 28,- |
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Abstract
We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.
