Paper Title:
Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container
  Abstract

We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.

  Info
Periodical
Key Engineering Materials (Volumes 447-448)
Edited by
Jianhong Zhao, Masanori Kunieda, Guilin Yang and Xue-Ming Yuan
Pages
61-65
DOI
10.4028/www.scientific.net/KEM.447-448.61
Citation
K. Kitamura, T. K. Doi, S. Kurokawa, Y. Umezaki, Y. Matsukawa, Y. Ooki, T. Hasegawa, I. Koshiyama, K. Ichikawa, Y. Nakamura, "Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container ", Key Engineering Materials, Vols. 447-448, pp. 61-65, 2010
Online since
September 2010
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Price
$32.00
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