Paper Title:
Evaluation of Component Reliability Using Data Derived from Infrared Thermography
  Abstract

Condition monitoring of components is commonly required to evaluate integrity, manage maintenance and predict impending failure. The condition of many electrical and mechanical components is revealed by their thermal signature which can be reliably monitored by infrared camera. Thermal data obtained optically has the advantage of being non-contact so that moving mechanical parts and high voltage electrical components, including those located in hazardous environments or with difficult access, can be readily monitored. This paper proposes that data obtained by such methods is processed within a model in order to identify the imminent failure of a component or to estimate the probability that a component may exceed its operating tolerances at any given time within the remainder of its expected life.

  Info
Periodical
Edited by
Daizhong Su, Qingbin Zhang and Shifan Zhu
Pages
275-278
DOI
10.4028/www.scientific.net/KEM.450.275
Citation
J. Redgate, A. Al-Habaibeh, D. Z. Su, T. Wilmshurst, J. Rudd, "Evaluation of Component Reliability Using Data Derived from Infrared Thermography ", Key Engineering Materials, Vol. 450, pp. 275-278, 2011
Online since
November 2010
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$32.00
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