Paper Title:
High Reliability Pb-Free Printed Circuit Board Assembly
  Abstract

The solderability and reliability of SnAgCu and SnAgCuSbBiNi lead-free solders were assessed against SnPbAg solder on a range of PCB finishes. A novel solderability test has been developed to assess the solder system’s ability to realign when a deliberately inaccurate solder stencil printing process was applied. This has shown to be an excellent way to compare PCB finishes and solders, as well as define process parameters. Electroless Nickel Immersion Gold (ENIG) finish proved to give the best solderability and the optimum process parameters were also found. SnPbAg solder has shown superior thermal cycling performance compared to SnAgCu.

  Info
Periodical
Edited by
Daizhong Su, Qingbin Zhang and Shifan Zhu
Pages
9-12
DOI
10.4028/www.scientific.net/KEM.450.9
Citation
S.D.T. Weller, I.P. Jones, I. M. Fox, T. Hirst, "High Reliability Pb-Free Printed Circuit Board Assembly", Key Engineering Materials, Vol. 450, pp. 9-12, 2011
Online since
November 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

  | Authors: Osman Saliza Azlina, Ali Ourdjini, Mohd Halim Irwan Ibrahim
Chapter 2: Advances in Mechanics
Abstract:In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the...
232
Authors: Xiao Ming Hu
Chapter 7: Materials Engineering, Chemical Engineering and Materials Processing Technologies
Abstract:this paper introduced the important soldering interconnect technology in SMT. In electric product manufacturing process, sometime we must...
3001
Authors: Mohamed Arif Azmah Hanim, M.N. Mohamad Aznan, R. Muhammad Raimi, A. Muhammad Azrol Amin
Chapter 6: Materials for Solar Cells, Energy Storage and Electronics
Abstract:This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC...
175