Paper Title:
Effects of Grain Size on Fatigue Crack Propagation in Copper Film
  Abstract

Using a fatigue testing method by which fatigue cracks can be initiated and propagated in a film adhered to cover a circular through-hole in a base plate subjected to cyclic loads, annealed copper films of 100m thickness with different crystal grain sizes were fatigued. The fatigue crack propagation in the film with large grains was often decelerated, so the crack propagation rate of the film with the large grain was lower than that of the film with the small grain. When the crack propagation was decelerated, the crack opening displacement obtained from the film with large grain size was smaller than that obtained from the film with small grain size. The relationship between the fatigue crack propagation rate and the stress intensity factor estimated from the crack opening displacement was identical for the cracks in the film with the large grain and the small grain.

  Info
Periodical
Key Engineering Materials (Volumes 452-453)
Edited by
A. Saimoto and M.H. Aliabadi
Pages
289-292
DOI
10.4028/www.scientific.net/KEM.452-453.289
Citation
K. Shimizu, T. Torii, "Effects of Grain Size on Fatigue Crack Propagation in Copper Film", Key Engineering Materials, Vols. 452-453, pp. 289-292, 2011
Online since
November 2010
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Price
$32.00
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