Paper Title:
Application and Prospects of Packaging Technology of MEMS
  Abstract

Micro-electromechanical systems is called MEMS for short, it is the product of mutual integration for the micro-electronics and micro-mechanics, which covers mechanical, electrical, physical, biological and other modern technology. MEMS packaging is a key technology that has been developed based on electronic package technology. In order to strengthen the development of packaging process of MEMS, in particular, which are low cost, materials and packaging technology and has an ideal effect. The characteristics of MEMS packaging technology based on MEMS technologies are introduced, and the future development tendency and application of MEMS device packaging are previewed in this dissertation.

  Info
Periodical
Key Engineering Materials (Volumes 460-461)
Edited by
Yanwen Wu
Pages
274-279
DOI
10.4028/www.scientific.net/KEM.460-461.274
Citation
X. Z. Feng, L. J. Chen, J. W. Cheng, "Application and Prospects of Packaging Technology of MEMS", Key Engineering Materials, Vols. 460-461, pp. 274-279, 2011
Online since
January 2011
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Price
$32.00
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