Paper Title:
Stress Distribution Effect on a Stacked-Die QFN Package Manufacturing Processes
  Abstract

In the last decade, failure of microelectronic devices has become a prominent field of research all across the world. The results of this of failure analysis allow an engineer to choose package geometries and materials which reduce the risk of failure. This paper is meant to relate the stress effect on material properties during Quad Flat No-Leads (QFN) stacked-die packages manufacturing processes. To achieve the study, the finite element technique was used to perform an extensive structural analysis on a QFN package design once it was verified by related experiments. A QFN unit was developed in three dimensional geometry with various materials be will simulated in order to determine the location of failure. The induced stress results were also measured in the maximum value, indicating the low modulus and coefficient of thermal expansion (CTE) in the packaging material were important for reducing high stress during the manufacturing stages. However, numerical simulation demonstrated that the stress developments increased exponentially when the die attach temperature increased. Therefore, the induced stress can be relieved by having high die attach process temperature with an adequate bonding force and time. It was vital to control the induced stress in package materials during die attachment process for ensuring the reliability level of QFN packages.

  Info
Periodical
Key Engineering Materials (Volumes 462-463)
Edited by
Ahmad Kamal Ariffin, Shahrum Abdullah, Aidy Ali, Andanastuti Muchtar, Mariyam Jameelah Ghazali and Zainuddin Sajuri
Pages
1273-1278
DOI
10.4028/www.scientific.net/KEM.462-463.1273
Citation
I. Abdullah, A. Jalar, S. Abdullah, M.F. Rosle, M. F. M. Yunoh, "Stress Distribution Effect on a Stacked-Die QFN Package Manufacturing Processes", Key Engineering Materials, Vols. 462-463, pp. 1273-1278, 2011
Online since
January 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Shahrum Abdullah, Z. Endut, I. Ahmad, Azman Jalar, Suhaila M. Yusof
Abstract:Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level...
202
Authors: Xin Li, Li Liang, Fu Chun Wang
Abstract:Recently, with the development of highway traffic cause and long-span bridges, the vibration performances of highway bridges due to moving...
1614
Authors: M.F. Hamid, M.K. Abdullah, H. Yusoff, Sheikh Mohd Firdaus, Mohd Zulkifly Abdullah, Zulkifli Mohamad Ariff, M.A. Azmi
Chapter 4: Applied Mechanics, Design and Manufacturing
Abstract:3-D packaging is a technology that offers high density packaging and high performance. It enables chips to be stack in a single package and...
318
Authors: Roslina Ismail, Fuaida Harun, Azman Jalar, Shahrum Abdullah
Chapter 1: Materials and Technologies for Soldering and Packaging in Electronics
Abstract:This work is a contribution towards the understanding of wire bond integrity and reliability in relation to their microstructural and...
79