Paper Title:
Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models
  Abstract

The thermal stress and thermal fatigue life for three different microgyroscope chip models were investigated in this paper. The deformation and stress distribution in chip, at interface between microgyroscope and chip, and in the spring of microgyroscope were obtained for three different microgyroscope chip models by the finite element method. The results show that for the simplified model, no obvious differences from linear or nonlinear analyses are obtained and the fatigue life of microgyroscope chip can be predicted with the properly simplified model. Also, the model having the same process in fabricating microgyroscope and carrier has better reliability. This paper provides an effective method for the reliability analysis of microgyroscope chip.

  Info
Periodical
Key Engineering Materials (Volumes 462-463)
Edited by
Ahmad Kamal Ariffin, Shahrum Abdullah, Aidy Ali, Andanastuti Muchtar, Mariyam Jameelah Ghazali and Zainuddin Sajuri
Pages
622-627
DOI
10.4028/www.scientific.net/KEM.462-463.622
Citation
M. K. Yeh, C. L. Lu, "Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models", Key Engineering Materials, Vols. 462-463, pp. 622-627, 2011
Online since
January 2011
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Price
$32.00
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