Paper Title:
Investigation of the Correlation between IC Chip Pick-Up Performance and Peeling Behavior of Adhesive Tapes
  Abstract

It was investigated that the influences of the peeling behavior of adhesive tapes in peeling tests on IC chip pick-up performance. Needles peel off an IC chip with an adhesive film from the base material in the pick-up process, by sticking out the backside of the base material. In the case that the peeling forces of the adhesive tape decrease as the peeling speeds increase in peeling tests, only two kinds of behaviors were observed in pick-up test; the peeling propagated little and the IC chip was not peeled off under critical needle displacement while the pick-up was completed instantaneously over critical needle displacement. In the case that the peeling forces of the adhesive tape increase as the peeling speeds increase, the pick-up time decreased as the needle displacement increased. As a result, it can be concluded that the needle displacement where the peeling propagates instantaneously is critical for succeeded pick-up if the peeling forces of the adhesive tape decrease as the peeling speeds increase. If the peeling forces of the adhesive tape increase as the peeling speeds increase, the information of peeling speeds at each needle displacement are needed to estimate how long it takes to pick-up a chip.

  Info
Periodical
Key Engineering Materials (Volumes 462-463)
Edited by
Ahmad Kamal Ariffin, Shahrum Abdullah, Aidy Ali, Andanastuti Muchtar, Mariyam Jameelah Ghazali and Zainuddin Sajuri
Pages
807-811
DOI
10.4028/www.scientific.net/KEM.462-463.807
Citation
N. Saiki, K. Inaba, K. Kishimoto, H. Seno, K. Takahashi, "Investigation of the Correlation between IC Chip Pick-Up Performance and Peeling Behavior of Adhesive Tapes", Key Engineering Materials, Vols. 462-463, pp. 807-811, 2011
Online since
January 2011
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Price
$32.00
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