Paper Title:
Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball
  Abstract

Semiconductor packages that use metallization and lead-free solders are increasingly being used in electronic products. In this study, interface reactions and joint-strength reliability were investigated for Sn-3W%Ag-0.5W%Cu solder ball joints joined to Cr/Cu and Cr/Ni-40W% metallization layers that were heat treated at 260°C. The strength of the joint with the Cr/Cu metallization layer decreased as the duration of the heat treatment increased. Sn and Cr interface reactive layers were generated after the loss of Cu in the Cr/Cu metallization layer, but the connection was maintained. By contrast, the connection of the joint to the Cr/Ni-40W metallization layer was relatively stable under the heat treatment conditions investigated.

  Info
Periodical
Key Engineering Materials (Volumes 462-463)
Edited by
Ahmad Kamal Ariffin, Shahrum Abdullah, Aidy Ali, Andanastuti Muchtar, Mariyam Jameelah Ghazali and Zainuddin Sajuri
Pages
849-854
DOI
10.4028/www.scientific.net/KEM.462-463.849
Citation
C. Yorita, T. Kobayashi, I. Shohji, "Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball", Key Engineering Materials, Vols. 462-463, pp. 849-854, 2011
Online since
January 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jong Woong Kim, Sun Kyu Park, Seung Boo Jung
Abstract:Ball shear test was investigated in terms of effects of important test parameters, i.e. shear height and shear speed, with an experimental...
851
Authors: Xiao Le Feng, Jie Yang
Chapter 4: Materials for Microelectronic Industry and Magnetic Materials
Abstract:The wettability of Sn-0.3Ag-0.7Cu-xPr solders on Cu substrate was determined by the wetting balance method, and the mechanical properties of...
456
Authors: Roman Koleňák, Igor Kostolný, Daniel Dřímal, Andrej Rabatin
Chapter 1: Materials and Technologies for Soldering and Packaging in Electronics
Abstract:The aim of research consisted in the study of wettability of Sn-based solders on ceramic Al2O3 material by heating with...
87