Paper Title:
Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure
  Abstract

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

  Info
Periodical
Edited by
Pavel Šandera
Pages
491-494
DOI
10.4028/www.scientific.net/KEM.465.491
Citation
M. Nicák, O. Švecová, J. Pulec, J. Šandera, I. Szendiuch, "Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure", Key Engineering Materials, Vol. 465, pp. 491-494, 2011
Online since
January 2011
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Price
$32.00
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