Paper Title:
Fatigue Testing of Thin Films
  Abstract

Thin film processing has been a driving technology in microelectronics and mechanics for years. The reliability of such devices is often limited by the failure of thin films. Therefore a deeper understanding of fatigue mechanisms of thin films through experiments is necessary to develop physical based lifetime models. Thus, this paper focuses on a novel setup for micro beam bending of thin metal films on Si cantilever substrate and first results will be presented.

  Info
Periodical
Edited by
Pavel Šandera
Pages
552-555
DOI
10.4028/www.scientific.net/KEM.465.552
Citation
S. Burger, B. Rupp, A. Ludwig, O. Kraft, C. Eberl, "Fatigue Testing of Thin Films", Key Engineering Materials, Vol. 465, pp. 552-555, 2011
Online since
January 2011
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