Paper Title:
Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA
  Abstract

This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.

  Info
Periodical
Key Engineering Materials (Volumes 467-469)
Edited by
Dehuai Zeng
Pages
950-955
DOI
10.4028/www.scientific.net/KEM.467-469.950
Citation
Z. Kornain, A. Jalar, R. Rasid, C.S. Foong, T.L. Wong, "Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA", Key Engineering Materials, Vols. 467-469, pp. 950-955, 2011
Online since
February 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Tian Shu Liu, Xiang Bao Chen, Bao Yan Zhang
Abstract:The cure kinetics of middle temperature curing 3234 epoxy resin was investigated under both isothermal and dynamic curing conditions by...
1041
Authors: Mei Yang, Shi Lin Yan, Mei Liu
Abstract:The cure kinetic properties of 191# resin was studied by means of the differential scanning calorimeter (DSC) data. Dynamic DSC scanning at...
1271
Authors: Yasir Nawab, Nicolas Boyard, Vincent Sobotka, Pascal Casari, Frédéric Jacquemin
Abstract:Residual stresses development during manufacturing of composites depends mostly on the shrinkage behaviour of the polymer matrix from the...
19
Authors: Xue Qin Li, Zi Long Zhang, Xiao Su Yi
Chapter 8: Sensor Technology
Abstract:Optimizing the curing temperature to reducing the process costs may influence the properties of the material and bring quality assurance...
947
Authors: Waefatimah Waenawae, Santi Pumkrachang, Syahril bin Zainudin, Thammasit Vongsetskul, Tanakorn Osotchan
Chapter 1: Polymers and Composites
Abstract:Epoxy adhesive used in electronic packaging could normally be cured by ultraviolet light, heat at high temperature or dual cured by both...
3