This work aims to enhance thermal conductivity of thin film without compromising the other properties of polymer. In this study, three types of fillers in nano size with high thermal conductivity properties were studied; silicon nitride, boron nitride and synthetic diamond. The contents of fillers were varied between 0-2 vol. %. Epoxy nano-composite solution filled with high thermal conductivity fillers was spun at 1500-2000 rpm to produce thin film in the thickness of 40-60 µm. Thermal conductivity properties were measured by using hot disc technique. It was found that the thermal conductivity increases as filler loading increases. The mechanical properties of the thin film epoxy composites were determined by using tensile test (ASTM D882). As predicted, the tensile modulus was found increasing with the addition of fillers and reasonable agreements were obtained from the SEM images of the fracture surfaces.