Paper Title:
Experimental Investigation on Transient Process of a New-Type Heat-Pipe Heat-Sink
  Abstract

In order to verify whether a new kind heat pipe heat sink can meet the requirement of high energy chip cooling or not, an experiment was conducted under heating and cooling process with a constant airflow rate. The transient heat exchange rate and transient temperature response of four thermocouples mounted on the upwind surface of the heat sink condenser were obtained. Results show that heat resistance decreases with increase in heat transfer rate under heating process, and the heat resistance is about 0.22K/W with the airflow rate 40m3/h. The transient temperature response is also analyzed with theory.

  Info
Periodical
Key Engineering Materials (Volumes 474-476)
Edited by
Garry Zhu
Pages
880-882
DOI
10.4028/www.scientific.net/KEM.474-476.880
Citation
X. L. Xie, "Experimental Investigation on Transient Process of a New-Type Heat-Pipe Heat-Sink", Key Engineering Materials, Vols. 474-476, pp. 880-882, 2011
Online since
April 2011
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