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MEMS/NEMS Nano Technology

Volume 483
doi: 10.4028/www.scientific.net/KEM.483
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Preface

Application of Ultrasonic Stress Relief in the Fabrication of SU-8 Micro Structure

Authors: Li Qun Du, Qi Jia Wang, Xiao Lei Zhang

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Design and Empirical Study for Coner Compensation in 25% Wt TMAH Etching on (100) Silicon Wafers

Authors: Zheng Yi Niu, Xue Zhong Wu, Pei Tao Dong, Ding Bang Xiao, Zhan Qiang Hou, Zhi Hua Chen, Xu Zhang

9

Characterization of AlGaN/GaN Cantilevers Fabricated with Deep-Release Techniques

Authors: Jian An Lv, Zhen Chuan Yang, Gui Zheng Yan, Yong Cai, Bao Shun Zhang, Kevin J. Chen

14

Dynamic Characteristics Measurement of Silicon Micro-Cantilever in Low Temperature Environment

Authors: Dong Sheng She, Xiao Dong Wang, Xi Wen Zhang, Li Ding Wang

18

Low Cost Fabrication of Micro Glass Cavities For MEMS Wafer Level and Hermetic Packaging

Authors: Jin Tang Shang, Jun Wen Liu, Di Zhang, Bo Yin Chen, Chao Xu, Xin Hu Luo, Hui Yu, Jing Dong Liu, Qing An Huang, Jie Ying Tang, Ming Qin

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Study of Under Etching Characters of Si (100) in Surfactant Added TMAH

Authors: Qi Fang Hu, Cheng Chen Gao, Yi Long Hao, Yang Xi Zhang

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Design and System-Level Simulation of a Novel On-Chip Test Based on Macromodels

Authors: Guan Le, Jia Li Gao, Jin Kui Chu

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An Electrostatic Force Feedback Approach for Extending the Bandwidth of MEMS Vibratory Gyroscope

Authors: Jian Cui, Zhong Yang Guo, Qian Cheng Zhao, Zhen Chuan Yang, Yi Long Hao, Gui Zhen Yan

43

Fabrication of Large Area, 70 nm Pitch Nanograting Patterns by Nanoimprint Lithography Using Flexible Polymer Stamp

Authors: Fan Tao Meng, Jin Kui Chu, Gang Luo, Zhi Tao Han, Zhi Wen Wang

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