Paper Title:
Study on Ultrasonic Fusion Bonding for Polymer Microfluidic Chips
  Abstract

Ultrasonic fusion bonding is a potential method for mass-production of polymer microfluidic chips. However, the micro structures in the chips are easily damaged or even destroyed due to poor controllability and uniformity of the melted energy directors in ultrasonic bonding process. In this paper, a novel micro joint including energy directors and flow blocks is presented. The flow profile of the melted energy directors is controlled by the dimensions of the flow blocks, auxiliary energy-equilibrating structures are also designed to prevent the uneven melt of energy directors. Polymethyl methacrylate (PMMA) microfluidic chips with the new joints were fabricated and ultrasonic bonding experiments were conducted. Micro channels with characteristic dimension of tens of microns were successfully sealed in 0.3 s and free of deformation.

  Info
Periodical
Edited by
Xiaohao Wang
Pages
311-315
DOI
10.4028/www.scientific.net/KEM.483.311
Citation
Y. Luo, S. Q. He, L. J. Wang, Z. B. Zhang, "Study on Ultrasonic Fusion Bonding for Polymer Microfluidic Chips", Key Engineering Materials, Vol. 483, pp. 311-315, 2011
Online since
June 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: K. Rajanna, S. Tanaka, Toshio Itoh, Masayoshi Esashi
1527
Authors: Sheng Lu, Yan Chen, Zhi Ping Weng, Jing Chen
Chapter 6: Petroleum Machinery and Engineering
Abstract:Plasma spraying process was carried out to prepare NiCoCrAlY bonding coating and Al2O3-13%TiO2 ceramic...
575
Authors: Guo Ning Liu, Hua Dong Zhao, Wei Yang, Sheng Gang Ma, Ming Hao Zhao
Chapter 1: Development and Utilization of Solar Energy
Abstract:Aiming at expanding and extending the application of photovoltaic energy technology into a bigger scope, a kind of soft substrate with...
51
Authors: Yi Cheng Huang, Kun Yang Li
Chapter 7: Intelligent Mechatronics
Abstract:In this paper, the study for the bonding tool position of ultrasonic transducers for thermosonic Flip-Chip LED bonding is presented....
1670
Authors: Chun Yu Wang, Qing Wang, Han Zhu Li, Xiao Zhi Ji, Zhi Long Kang
Chapter 10: Steel, Alloys and Coating
Abstract:Keywords: Electroless plating Ni, CeO2, Micro-connection pad, Wire bonding Abstract. It is Ni/CeO2 coatings that have been prepared on SiC/Al...
1925