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Low-Cost Fabrication Strategies of Microfluidic Device on Glass Substrate

Journal Key Engineering Materials (Volume 483)
Volume MEMS/NEMS Nano Technology
Edited by Xiaohao Wang
Pages 83-88
DOI 10.4028/www.scientific.net/KEM.483.83
Citation Dong Ling Li et al., 2011, Key Engineering Materials, 483, 83
Online since June, 2011
Authors Dong Ling Li, Zhi Yu Wen, Zheng Guo Shang, Sheng Qiang Wang
Keywords Etching Mask, Fabrication, Microfluidic Device, Undercut Ratio, Wet Etching
Abstract

This paper presents a simple but reliable fabrication process for microfluidic devices on glass substrate using wet etching technology. Instead of using expensive Pyrex glasses as substrates and depositing expensive metal or polysilicon/amorphous silicon as etch masks in conventional method, glass slide is used as substrate and a single-layer negative photoresist RFJ-220 is used as the etching mask. The etch rates, generation of defects, undercut ratio and surface roughness are studied. In order to achieve high etching depth and smooth surface, buffered oxide etching with hydrochloric acid as additive is proposed. By proper cleaning and long-time hard baking, the undercut ratio can approach to 1. An 110μm depth microchannel with smooth surface is achieved. This fabrication process leads to a considerable reduction of process steps, fabrication time and material consumption. With this technique, we successfully fabricated a microfluidic device, which is used in the capture of hepatoma cells HepG2.

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