Paper Title:
Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation
  Abstract

Packaging high power radio frequency integrated circuits (RFICs) in low temperature cofired ceramic (LTCC) presents many challenges. Within the constraints of LTCC fabrication, the design must provide the usual electrical isolation and interconnections required to package the IC, with additional consideration given to RF isolation and thermal management. While iterative design and prototyping is an option for developing RFIC packaging, it would be expensive and most likely unsuccessful due to the complexity of the problem. To facilitate and optimize package design, thermal and mechanical simulations were used to understand and control the critical parameters in LTCC package design. The models were validated through comparisons to experimental results. This paper summarizes an experimentally-validated modeling approach to RFIC package design, and presents some results and key findings.

  Info
Periodical
Edited by
Takashi Goto, Yi-Bing Cheng and Takashi Akatsu
Pages
192-203
DOI
10.4028/www.scientific.net/KEM.484.192
Citation
N. Young, J. Johnson, K. G. Ewsuk, "Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation", Key Engineering Materials, Vol. 484, pp. 192-203, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Gianluca Buffa, Livan Fratini
Abstract:During the last years welded titanium components have been extensively applied in aeronautical and aerospace industries because of their high...
304
Authors: Achmad Zubaydi, Nurul Muhayat, Sulistijono, M. Zaed Yuliadi, Budie Santosa, Dony Setyawan, Syaiful Haqi
Chapter 4: Machinning and Forming Materials Technologies, Other Manufacturing Technologies
Abstract:The effects of backplate thermal diffusivity on mechanical properties of friction stir welded (FSW) aluminum alloy 5083 joints were studied...
219