Paper Title:
Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
  Abstract

Back grinding is the key working procedure in the silicon wafer manufacturing process. Ground silicon wafers ought to have low subsurface damage layer thickness (SSD ) and surface roughness value. It requires that the wheel should have high self-sharpening ability and consistent performance. In this paper, the research on pore-forming agent in order to improve the wheel’s self-sharpening ability of the resin-bond diamond grinding was conducted. The research includes the pore-forming mechanism of various pore-forming agent, the influence of pore-forming agent’s type and the effect on the bond’s strength, the influence of pore-forming agent on the grinding performance of the wheel. Moreover, it examines the improved grinding wheel’s grinding effect by grinding tests.

  Info
Periodical
Edited by
Feng Zhu, Xipeng Xu and Renke Kang
Pages
169-174
DOI
10.4028/www.scientific.net/KEM.487.169
Citation
K.H. Li, Q. Guo, M.Y. Liu, Y.J. Zhao, D.L. Shi, "Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers", Key Engineering Materials, Vol. 487, pp. 169-174, 2011
Online since
July 2011
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$32.00
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