Paper Title:
Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect
  Abstract

Method of compound machining is used to process single crystal silicon and SrTiO3 ceramic substrates, and the factors on effects of compound machining are studied such as magnetic field intensity, processing time, rotating speed of lapping plate and lapping pressure. The results show that the roughness of work pieces processed by compound machining are smaller than that by lapping based on cluster MR effect and polyurethane pad polishing process, while the material removal rate is higher than polyurethane pad polishing process, therefore, compound machining shows its synergistic effect between lapping based on cluster MR effect and polyurethane pad polishing process. The type and properties of workpiece material, and machining parameters both have a significant impact on the roughness and material removal rate of compound machining process of polyurethane polishing pad and cluster abrasive brush based on MR effect.

  Info
Periodical
Edited by
Feng Zhu, Xipeng Xu and Renke Kang
Pages
238-242
DOI
10.4028/www.scientific.net/KEM.487.238
Citation
M. Li, Q. S. Yan, J. B. Lu, J. F. Chai, "Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect", Key Engineering Materials, Vol. 487, pp. 238-242, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Suo Xian Yuan, Yun Xia Hao
Abstract:In recent years, the demands on product performance are improving, particularly in the aviation; electronics, precision instruments and other...
713
Authors: Qian Fa Deng, Ping Zhao, Bing Hai Lv, Ju Long Yuan, Zhi Wei Wang
Chapter 1: Grinding Technology
Abstract:Abrasive machining is an important process for the manufacturing of advanced ceramics. The demand for advanced ceramics with better quality...
251
Authors: Heng Zhen Dai, Zhu Ji Jin, Shang Gao, Z.C. Tao
Chapter 1: Grinding Technology
Abstract:Aiming at the severe surface/subsurface damage of Al2O3ceramic ground by diamond grinding wheel, the...
270
Authors: Mahadev Gouda Patil, Kamlesh Chandra, Prabhu Shankar Misra
Chapter 5: Powder Metallurgy and Plastic Deformation
Abstract:Abstract: The magnetic abrasive finishing (MAF) process which was introduced during the late 1940s has emerged as an important...
1577
Authors: Jian Xiu Su, Jia Xi Du, Xing Long Liu, Hai Na Liu
Abstract:SiC crystal substrate has been widely used in the area of microelectronics, photonics and new materials, such as semiconductor lighting,...
250