Paper Title:
Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites
  Abstract

Based on the theory of grinding temperature field and the grinding forces obtained from the experiment, the heat flow during grinding of SiCp/Al composites was calculated. The temperature distributions have been simulated during grinding process in the case of diamond wheel and SiC wheel. The effects of grinding wheel, workpiece speed and grinding depth on the grinding temperature field were discussed. The results show that the grinding temperature with SiC wheel is much higher than that of diamond wheel in the same grinding condition, and the grinding temperature gradually decreases with the increasing of the workpiece speed or the decreasing of the grinding depth for both the diamond wheel and SiC wheel.

  Info
Periodical
Edited by
Feng Zhu, Xipeng Xu and Renke Kang
Pages
70-74
DOI
10.4028/www.scientific.net/KEM.487.70
Citation
C.Y. Zhang, L. Zhou, S. T. Huang, "Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites", Key Engineering Materials, Vol. 487, pp. 70-74, 2011
Online since
July 2011
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