Macroscopic delamination of polymer-metal interfaces is one of the main failure modesobserved in micro-electronic components. Due to the irregularly shaped metal roughness proﬁle, thisdelamination not only consists of interface separation but also bulk cracking at the micro-scale ofthe roughness. In fact, one of the key mechanisms that results in increased adhesion toughness atroughened interfaces is the transition from adhesive to cohesive failure. A semi-analytical approachis discussed in which the competition between adhesive and cohesive cracking is analyzed by meansof the theoretical relation between interface and kinking stress intensity factors. The parameters thatdeﬁne this relation, the solution coefﬁcients, are quantiﬁed by ﬁnite element (FE) simulations. Accordingly, the crack kinking location and kinking angle into the softer polymer is readily calculated.Furthermore, the geometrical effect of roughness is evaluated by means of FE simulations in whichthe interface topology follows from measured roughness proﬁles while also including interface delamination using cohesive zone elements.