Paper Title:
Numerical Analysis of Crack Propagation in Silicon Nitride
  Abstract

The properties of ceramics, specifically low density, high hardness, high temperature capability and low coefficient of thermal expansion are of most interest to rolling element manufacturers. The influence of ring crack size on rolling contact fatigue failure has been studied using numerical fracture analysis. Such cracks are very often found on ceramic bearing balls and decrease fatigue life rapidly. The numerical calculation are based on a three dimensional model for the ring crack propagation. The stress intensity factors along crack front are analyzed using a three-dimensional boundary element model. The numerical analysis is verified by experimental studies.

  Info
Periodical
Edited by
Waldemar Karaszewski
Pages
216-225
DOI
10.4028/www.scientific.net/KEM.490.216
Citation
W. Karaszewski, "Numerical Analysis of Crack Propagation in Silicon Nitride", Key Engineering Materials, Vol. 490, pp. 216-225, 2012
Online since
September 2011
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