Paper Title:
Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate
  Abstract

In this paper, application of multilayered circuit substrates has been studied, the glass ceramic (50%Al2O3-50%glass) with low temperature co-fired and good performance as the raw material was used, by means of calculating the apparent activation energy of densification in the experiment and observing the SEM images of glass ceramic substrate section, the densification mechanism of glass ceramic substrate sintering is analyzed.

  Info
Periodical
Edited by
Yiwang Bao, Danyu Jiang, Li Tian and Jianghong Gong
Pages
122-125
DOI
10.4028/www.scientific.net/KEM.492.122
Citation
Q. He, Z. T. Geng, "Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate", Key Engineering Materials, Vol. 492, pp. 122-125, 2012
Online since
September 2011
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