Paper Title:
Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique
  Abstract

In this paper, in order to avoid aggregate of nanodiamonds and reduce the damage problem caused by the hard abrasives during polishing, a kind of ultra-fine nanodiamond abrasive polishing pad was fabricated by means of sol-gel technology. The polishing pad was then used to polish silicon wafer on a nano-polishing machine. The surface morphologies and roughness were measured by both optical microscope and atomic force microscope (AFM). It is found that it was easy to machine the silicon wafer to mirror surface after polishing with the nanodiamond pad. And the surface roughness of the silicon wafer was reduced to 0.402 nm.

  Info
Periodical
Edited by
Michael N. Morgan, Andrew Shaw and Otar Mgaloblishvili
Pages
1-6
DOI
10.4028/www.scientific.net/KEM.496.1
Citation
G. Q. Hu, J. Lu, X. P. Xu, "Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique", Key Engineering Materials, Vol. 496, pp. 1-6, 2012
Online since
December 2011
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