Paper Title:

Multi-Pass Nanometric Machining Simulation Using the Molecular Dynamics (MD)

Periodical Key Engineering Materials (Volume 496)
Main Theme Precision Machining VI
Edited by Michael N. Morgan, Andrew Shaw and Otar Mgaloblishvili
Pages 241-246
DOI 10.4028/
Citation Akinjide Oluwajobi et al., 2011, Key Engineering Materials, 496, 241
Online since December 2011
Authors Akinjide Oluwajobi, Xun Chen
Keywords Molecular Dynamic Simulation, Multi-Pass, Nanometric Machining
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The multi-pass nanometric machining of copper with diamond tool was carried out using the Molecular Dynamics (MD) simulation. The copper-copper interactions were modelled by the EAM potential and the copper-diamond interactions were modelled by the Morse potential. The diamond tool was modelled as a deformable body and the Tersoff potential was applied for the carbon-carbon interactions. It was observed that the average tangential and the normal components of the cutting forces reduced in the consecutive cutting passes. Also, the lateral force components are affected by atomic vibrations and the cross sectional area during the cutting process.