Comparison of Picosecond and Femtosecond Laser Ablation for Surface Engraving of Metals and Semiconductors
| Periodical | Key Engineering Materials (Volume 496) |
|---|---|
| Main Theme | Precision Machining VI |
| Edited by | Michael N. Morgan, Andrew Shaw and Otar Mgaloblishvili |
| Pages | 61-66 |
| DOI | 10.4028/www.scientific.net/KEM.496.61 |
| Citation | John Lopez et al., 2011, Key Engineering Materials, 496, 61 |
| Online since | December, 2011 |
| Authors | John Lopez, Florent Deloison, Anne Lidolff, Martin Delaigue, Clemens Hönninger, Eric Mottay |
| Keywords | Engraving, Femtosecond, Micro Processing, Picosecond, Process Efficiency |
| Price | US$ 28,- |
Pico and femtosecond lasers present a growing interest for industrials applications such as surface structuring [1] or thin film selective ablation [2]. Indeed, they combine the unique capacity to process any type of material (dielectrics, semiconductors, metals) with an outstanding precision and a reduced affected zone. We report on results about surface engraving of metals (Al, Cu, Mo, Ni), semiconductor (Si) and polymer (PC) using a picosecond thin disk Yb:YAG-amplifier. The pulse duration of this source can be changed using two different configurations: direct amplification of a 34ps-oscillator on one hand, and 1ps-chirped pulse amplification (CPA) scheme on the other hand. The results obtained with this thin disk laser are compared to ones achieved with two commercial femtosecond lasers respectively based on Yb-doped crystals and fibers, and operating at similar output power levels (up to 15Watt).
