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Precision Machining VI

Volume 496
doi: 10.4028/www.scientific.net/KEM.496
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Preface, Sponsors and Committees

Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique

Authors: Guang Qiu Hu, Jing Lu, Xi Peng Xu

1

Calculation of Effective Ground Depth of Cut by Means of Grinding Process Model

Authors: Takazo Yamada, Michael N. Morgan, Hwa Soo Lee, Kohichi Miura

7

Grindability of Single Crystal Sapphire in Medical Use and the Scheme of Forming Highly Precise Spherical Heads

Authors: Otar Mgaloblishvili, Rauli Turmanidze, David Butskhrikidze, Mariam Beridze

13

Error Size of the Helix (screw) Groove by Grinding

Authors: Karel Jandečka

19

Influence of the Corrosion Surrounding on Surface Quality of Grounded Hardened Steels

Authors: Martin Novak

25

New Laser Machine Tools for Processing Carbon Fibre Reinforced Plastic (CFRP)

Authors: Paul W French, Alexander Wolynski, Mo Naeem, Martin C Sharp

30

Advanced Fiber Laser Perforation Technology for Thermoplastic Pre-Preg Material

Authors: A.A Kutin, M.V. Turkin

36

Laser Assisted Micro Grinding of High Strength Materials

Authors: Wen Long Chang, Xi Chun Luo, Qi Ling Zhao, Ji Ning Sun, Yi Zhao

44

Transformation "Insulator-Conductor" after Laser Irradiation of the Polymer Films

Authors: Jimsher N. Aneli, Elena F. Semiletova, Nana V. Bakradze, Teimuraz N. Dumbadze

50

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