Status and Trends of Fixed Abrasive Polishing on Semiconductor |
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| Journal | Key Engineering Materials (Volume 499) |
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| Volume | Anti-Fatigue Design and Manufacturing Technologies I |
| Edited by | Dunwen Zuo, Chuanzhen Huang, Ming Chen, Jun Li and Guo Hun |
| Pages | 390-396 |
| DOI | 10.4028/www.scientific.net/KEM.499.390 |
| Citation | Y. Zhao et al., 2012, Key Engineering Materials, 499, 390 |
| Online since | January, 2012 |
| Authors | Y. Zhao, Dun Wen Zuo, Yu Li Sun |
| Keywords | Fixed Abrasive, Polishing, Polishing Pad, Semiconductor Material |
| Abstract | The necessity of fixed abrasive CMP in polishing semiconductor materials processing was analyzed. Compared the shortcomings of traditional free abrasive polishing with the advantages of fixed abrasive polishing, the applications of fixed abrasive polishing technology in semiconductor processing were described. A variety of fixed abrasive polishing pad production methods were introduced. The development trend of fixed abrasive polishing was prospected. |
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