Paper Title:
Fatigue Crack Growth and Closure through a Tensile Residual Stress Field under Random Loading
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 51-52)
Edited by
Kang Yong Lee and Hideaki Takahashi
Pages
283-288
DOI
10.4028/www.scientific.net/KEM.51-52.283
Citation
J.S. Kim, C. Y. Kim, J.H. Song, "Fatigue Crack Growth and Closure through a Tensile Residual Stress Field under Random Loading", Key Engineering Materials, Vols. 51-52, pp. 283-288, 1991
Online since
January 1991
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Price
$32.00
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