Paper Title:
Particle/Substrate Interactions during Thermal Spraying
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 53-55)
Edited by
P.J. Darragh and R.J. Stead
Pages
499-504
DOI
10.4028/www.scientific.net/KEM.53-55.499
Citation
D. Wang, C.C. Berndt, "Particle/Substrate Interactions during Thermal Spraying", Key Engineering Materials, Vols. 53-55, pp. 499-504, 1991
Online since
January 1991
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Price
$32.00
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