Paper Title:
Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 86-87)
Edited by
S. Hampshire, M. Buggy and A. J. Carr
Pages
361-368
DOI
10.4028/www.scientific.net/KEM.86-87.361
Citation
C.M. Flannery, D. Zhang, G.M. Crean, S.C. O'Mathuna, "Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications", Key Engineering Materials, Vols. 86-87, pp. 361-368, 1993
Online since
July 1993
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Price
$32.00
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