Paper Title:
Thermal Shock and Thermal Cycling Behavior of Silicon Nitride Ceramics
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 89-91)
Main Theme
Edited by
Michael J. Hoffmann, Paul F. Becher and Günther Petzow
Pages
605-610
DOI
10.4028/www.scientific.net/KEM.89-91.605
Citation
G. Kirchhoff, M. Holzherr, U. Bast, U. Rettig, "Thermal Shock and Thermal Cycling Behavior of Silicon Nitride Ceramics ", Key Engineering Materials, Vols. 89-91, pp. 605-610, 1994
Online since
August 1993
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Price
$32.00
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