Paper Title:
High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 89-91)
Main Theme
Edited by
Michael J. Hoffmann, Paul F. Becher and Günther Petzow
Pages
633-634
DOI
10.4028/www.scientific.net/KEM.89-91.633
Citation
A.A. Postnikov, V.G. Verjovka, "High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride", Key Engineering Materials, Vols. 89-91, pp. 633-634, 1994
Online since
August 1993
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.