Paper Title:
Ultrasonic Attenuation and Modulus Defect Associated with the Bordoni Peak in Copper Single Crystals
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 119-121)
Edited by
L.B. Magalas and S. Gorczyca
Pages
189-194
DOI
10.4028/www.scientific.net/MSF.119-121.189
Citation
A.O. Moreno Gobbi, J. A. Eiras, "Ultrasonic Attenuation and Modulus Defect Associated with the Bordoni Peak in Copper Single Crystals ", Materials Science Forum, Vols. 119-121, pp. 189-194, 1993
Online since
January 1993
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