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On the Dislocation Motion and Multiplication under Successively Applied Compressive and Tensile Stresses

Journal Materials Science Forum (Volumes 119 - 121)
Volume Internal Friction and Ultrasonic Attenuation in Solids
Edited by L.B. Magalas and S. Gorczyca
Pages 233-238
DOI 10.4028/www.scientific.net/MSF.119-121.233
Citation V.P. Kisel, 1993, Materials Science Forum, 119-121, 233
Authors V.P. Kisel
Keywords Alkali-Halides, Climb, Compressive-Tensile Stresses, Cross-Slip, Dislocation Motion, Multiplication, Semiconductor
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