Paper Title:
Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 126-128)
Edited by
Ph. Komninou and A. Rocher
Pages
351-354
DOI
10.4028/www.scientific.net/MSF.126-128.351
Citation
C.S. Nichols, D. A. Smith, "Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects", Materials Science Forum, Vols. 126-128, pp. 351-354, 1993
Online since
January 1993
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Price
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