Paper Title:
Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 126-128)
Edited by
Ph. Komninou and A. Rocher
Pages
399-402
DOI
10.4028/www.scientific.net/MSF.126-128.399
Citation
J.S. Lee, T.H. Kim, K.H. Lee, "Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites", Materials Science Forum, Vols. 126-128, pp. 399-402, 1993
Online since
January 1993
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Price
$32.00
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