Plasma Properties, Deposition and Etching
Materials Science Forum Volumes 140 - 142
doi:10.4028/www.scientific.net/MSF.140-142
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p1
PECVD of Silicon Dioxide from TEOS/Oxygen Mixtures
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957 K
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Authors: T.S. Cale, G.B. Raupp
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p17
Analysis and Design of Plasma Chemical Reactions Based on Quantum Chemical Methods
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239 K
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Authors: K. Sato
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p25
Advanced Simulation of Dry Etching Process Technology
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685 K
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Authors: J. Pelka
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p39
Anisotropic ECR Plasma Etching with Low-Energy Ions
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708 K
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Authors: Y. Tobinaga, T. Miyano, K. Fujimoto, M. Fujito, H. Fujiwara
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p55
High-Rate Sputtering with Electron Cyclotron Resonance and Electric-Mirror Excitation
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1 M
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Authors: Masaya Matsuoka
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p79
Modified ECR Plasma Deposition
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403 K
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Authors: S. Nakamura, Toshikazu Akahori, Satoshi Nakayama
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p89
DC Saddle-Field Plasma-Enhanced Vapour Deposition
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1 M
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Authors: R.V. Kruzelecky, S. Zukotynski
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p107
Theoretical Characterization of Electron Energy Distribution Function in RF Plasmas
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474 K
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Authors: M. Capitelli, G. Capriati, M. Dilonardo, C. Gorse, S. Longo
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p121
Ion Energy Distributions and Sidewall Profiles in Reactive Ion Etching
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481 K
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Authors: Paul W. May, David P. Field, D.F. Klemperer, Y.P. Song
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p133
Dissipative Structures and Nonequilibrium Phenomena in Plasma-Surface Interaction
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936 K
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Authors: Y.L. Khait
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p159
Source of Atomic Oxygen and its Application to Material Oxidation
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334 K
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Authors: A.M. Pointu, M. Touzeau, O. Guymont
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p171
Practical Applications of In-Situ Plasma-Etching Diagnostic Techniques
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882 K
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Authors: D.J. Thomas, P. Southworth, M.C. Flowers, N.J. Dartnell, R. Greef, Y. Liu
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p191
Laser-Aided Diagnostics of Processing Plasmas
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1 M
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Authors: K. Muraoka, M. Maeda
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p219
Radical Kinetics in Processing Plasmas: Optical Diagnostics of Gas Phase and Surface Reactions
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751 K
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Authors: J.P. Booth, G. Hancock
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p235
Negatively Charged Particles in Fluorocarbon RF Etch Plasmas: Density Measurements Using Microwave Resonance and the Photodetachment Effect
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982 K
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Authors: M. Haverlag, Akihiro Kono, G.M.W. Kroesen, F.J. de Hoog