Paper Title:
Evaluation of Substrate Degradation in Plasma Etch Processes Using Thermal Wave Analysis
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Periodical
Materials Science Forum (Volumes 140-142)
Edited by
J. J. Pouch and S. A. Alterovitz
Pages
541-564
DOI
10.4028/www.scientific.net/MSF.140-142.541
Citation
M. Engelhardt, "Evaluation of Substrate Degradation in Plasma Etch Processes Using Thermal Wave Analysis", Materials Science Forum, Vols. 140-142, pp. 541-564, 1993
Online since
October 1993
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Price
$32.00
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