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Plasma Properties, Deposition and Etching

Materials Science Forum Volumes 140 - 142

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• p497 Thermally Sprayed Coatings for Electrical and Electronic Applications   [ 1 M ]
  Authors: L. Pawlowski, Pierre Fauchais
• p521 ECR Plasma Etching Technology for ULSI   [ 703 K ]
  Authors: S. Samukawa
• p541 Evaluation of Substrate Degradation in Plasma Etch Processes Using Thermal Wave Analysis   [ 1011 K ]
  Authors: M. Engelhardt
• p565 Plasma Etching of Patterned Tungsten   [ 969 K ]
  Authors: S. Franssila
• p583 Microwave Plasma Oxidation of Silicon   [ 772 K ]
  Authors: Shigeru Kimura
• p603 Hydrogen Interaction with Disordered Silicon   [ 758 K ]
  Authors: S. Ashok, K. Srikanth
• p619 Damage Assessment of Dry Etched III-V Semiconductors for Nanoelectronics   [ 982 K ]
  Authors: R. Cheung
• p641 Reactive Ion Beam Etching for Microcavity Surface Emitting Laser Fabrication: Technology and Damage Characterization   [ 811 K ]
  Authors: A. Matsutani, T. Tadokoro, F. Koyama, K. Iga
• p659 Alkane Plasma Etching of Gallium Arsenide   [ 1 M ]
  Authors: V.J. Law, M. Tewordt, S.G. Ingram, G.A.C. Jones
• p689 Effects of ECR-Plasma Excitation in GaAs MBE Growth   [ 827 K ]
  Authors: T. Shibata, N. Yamamoto, Naoki Kondo, Y. Nanishi, M. Fujimoto
• p705 Plasma Treatment of Polymers for Improved Adhesion Properties   [ 852 K ]
  Authors: S. Nowak, O.M. Küttel
• p727 Study of Dry Development in Terms of Resist and Development Method   [ 609 K ]
  Authors: N. Abe, T. Motoyama