Paper Title:
Binding of Copper to Nanocavities in Silicon
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 143-147)
Edited by
Helmut Heinrich and Wolfgang Jantsch
Pages
1635-1640
DOI
10.4028/www.scientific.net/MSF.143-147.1635
Citation
S.M. Myers, D.M. Follstaedt, D.M. Bishop, "Binding of Copper to Nanocavities in Silicon", Materials Science Forum, Vols. 143-147, pp. 1635-1640, 1994
Online since
October 1993
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Price
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