Paper Title:
Unusual Diffusion and Precipitation Behavior of Ni and Cu in Si upon Elevated-Temperature Ion Implantation
  Abstract

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Periodical
Materials Science Forum (Volumes 143-147)
Edited by
Helmut Heinrich and Wolfgang Jantsch
Pages
803-808
DOI
10.4028/www.scientific.net/MSF.143-147.803
Citation
G. Langouche, M.F. Wu, J. De Wachter, H. Pattyn, A.-M. Van Bavel, "Unusual Diffusion and Precipitation Behavior of Ni and Cu in Si upon Elevated-Temperature Ion Implantation", Materials Science Forum, Vols. 143-147, pp. 803-808, 1994
Online since
October 1993
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