Paper Title:
Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 157-162)
Edited by
H.J. Bunge
Pages
1435-1442
DOI
10.4028/www.scientific.net/MSF.157-162.1435
Citation
D.B. Knorr, K.P. Rodbell, "Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects ", Materials Science Forum, Vols. 157-162, pp. 1435-1442, 1994
Online since
May 1994
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Price
$32.00
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